MEP EP#323: Hyperspace Part Packages

<h4><a href="https://macrofab.com/blog/mep-ep323-hyperspace-part-packages/">MEP EP#323: Hyperspace Part Packages</a><b><br></b></h4><p><b>The Worst Timeline: A Printer Company Is Putting DRM in Paper Now</b></p> <ul> <li aria-level="1">RFID chips inside the label spool</li> <li aria-level="1">What kind of RFID chip are they using that is this disposable?</li> <li aria-level="1">EFF <a href="https://www.eff.org/deeplinks/2022/02/worst-timeline-printer-company-putting-drm-paper-now">Article Link</a></li> </ul> <p><b>Component marking with the manufacturer in mind</b></p> <ul> <li aria-level="1">Why put indicator marks?</li> <li aria-level="1">Where?</li> <li aria-level="1">Both inside the footprint and outside</li> <li aria-level="1">Double and triple check that things are right on the design side <ul> <li aria-level="2">Diodes - Making Anode and also having the diode symbol on the board</li> </ul> </li> <li aria-level="1">Vias and marking</li> <li aria-level="1">Numbers for marking?</li> <li aria-level="1">TSSOP and similar style packaging</li> <li aria-level="1">Own your design and be prepared to support it</li> </ul>